Research Associate - Corning
Ling Cai is a Research Associate at Corning Research and Development Corporation. He is currently the technical lead for electrical property characterization at Corning. His general research interests include material and metrology development for electronic applications, process development for early-stage opportunity, and fundamental understanding of materials structure-property relationship. Since joining Corning, Ling managed several external collaborations with universities and national lab to accelerate the material innovation. Ling received BS degree in Applied Physics from California State University at San Bernardino in 2009, and PhD degree in Physics from Lehigh University in 2015.