Quality and Reliability Engineer - Intel
Joyce Gong received her Ph.D. in mechanical engineering from University of Michigan in 2017, where she studied nickel titanium shape memory alloy. After graduation, she joined Intel as a quality and reliability engineer for assembly and test technology development. Her first project was to certify Intel's first Embedded Multi-die Interconnect Bridge (EMIB) product. She then took on multiple roles in EMIB development before joining packaging pathfinding team in 2022. Her current work explores technology building blocks for Intel's advanced packaging roadmap, 5-10 years in the future.