Etching

Plasma-Therm Apex SLR ICP Etcher

The Plasma-Therm APEX SLR is an inductively coupled plasma reactive ion etcher which has been specially configured to etch III-V materials for research applications. The small footprint, low cost, ease of use and superior performance makes the Apex SLR ideal for a wide range of uniform, high quality ICP etch applications. Available gas chemistries include Cl₂ , BCl₃, CF₄ , O₂ , N₂, and Ar.

Chemical Wet Bench

Our chemical wet bench is prepared for acid and base wet chemical processing for pieces and wafers up to 6”. The bench is equipped with a hot plate, DI water and dry N₂ and stocked with a variety of chemicals for cleaning and wet etching of materials.

Technics 800 RIE

The Technics 800 Micro Reactive Ion Etch system enables higher aspect-ratio etching of silicon oxide and silicon nitride than otherwise achievable with wet etching. Our RIE is capable of processing samples from small pieces up to 6-inch wafers. Available gas chemistries include CF₄ , N₂, and O₂.

UVOCS Ozone Cleaner

The UVOCS ultraviolet ozone cleaner provides a simple, inexpensive and fast method of preparing ultra-clean surfaces free of organic contaminants. This process is ideal when thin film deposition with excellent adhesion to the surface is required.