The Integrated Nanofabrication and Cleanroom Facility (INCF) consists of the III-V and Silicon-based nanofabrication cleanrooms, consolidated into a single facility with expansion in both space and equipment. The cleanroom facility supports research and developments in microfabrication techniques, and device fabrications. All the semiconductor optoelectronic materials grown in the PI’s MOCVD laboratory will be fabricated into devices in this new cleanroom facility.
The cleanroom facility includes photo-lithography (Karl Suss MA-6), intermixing/contact annealing (RTA), III-V and dielectric etchers (RIE), SiO2 and Si3N4 deposition (PECVD), metallization and AR/HR (e-beam evaporator and sputterer), holography system (grating formation for DFB/DBR lasers), wet etching, wafer thinning, laser scribing, and basic laser packaging.
Department Contacts:
Renbo Song, INCF Technical Manager
Tony Jeffers, Cleanroom Manager
Grant Reed, Research Engineer
Patterning
The INCF houses a Class 100 photolithography room for all of their coating and patterning. Utilizing the programmable Solitec spinner, researchers coat various polymers and resists with up to 5 separate spin speeds and times. The Karl Suss MA 6/BA6 aligner is capable of both front and backside alignment and can achieve 2 um resolution on samples ranging from small pieces up to 3 inches.
Karl Suss MA-6, BA-6 Aligner
Mask aligner and UV exposure tool is designed for high resolution photolithography. The MA-6, BA-6 is able to perform both front and backside alignment of samples up to 3 inches. Exposure wavelengths of 365 and 405 nm are available. Soft contact, hard contact, vacuum contact and flood exposure modes are available. A split field microscope and monitor are used for top side alignment and cameras are used for backside alignment.
Karl Suss MJB-3 Aligner
The Karl Suss MJB-3 aligner is a manually operated contact aligner with a stage size accepting up to 3 inch wafers and uses a mask size of 4 inches. The UV light is unfiltered to provide an exposure using various spectrum lines from a 350 watt mercury short arc lamp. Because the stage height and contact pressure can be manually changed, this aligner can handle different wafer and mask thicknesses. Sample sizes from small pieces to 3 inch wafers can be processed. The MJB-3 is equipped with a split field microscope.
Reynolds Tech Developer Wet Bench
The Reynolds Tech Developer Wet Bench is used for photolithography. Digital hotplates are included for resist post exposure bakes or post develop hard bakes.
Solitec Programmable Spinner
The Solitec programmable spinner can be used with photo resists and various polymers. The Solitec spinner is capable of allowing the operator to adjust the ramp speed and up to 5 separate spin speeds and times on a single sample. Sample sizes from ¼” to 6” can be processed.
Etching
The INCF cleanroom offers flexible Plasma and Wet etch technology on a wide range of applications. Research processing of III-V, Silicon Bosch and Dielectric films is achieved with our RIE’s, DRIE and Wet Etch Chemistry etching. Piece processing and samples up to 6 inches can be processed.
Plasma-Therm Apex SLR ICP Etcher
Plasma-Therm APEX SLR provides etching capabilities over a variety of materials and substrates. The small footprint, low cost, ease of use and superior performance makes the Apex SLR ideal for a wide range of uniform, high quality ICP etch applications. Our etcher is specially configured to perform III-V semiconductor material etch applications.
Adixen I Speeder 100
The Adixen is an ICP DRIE which utilizes the Bosh process to produce straight walled deep vertical etching in silicon. It has a load lock and etching of samples up to 6” diameter is possible with appropriate fixtures. Substrate temperature can be chilled to modify etching characteristics. Biasing the substrate is done with a LF power supply. The entire operation is computer controlled.
Chemical Wet Bench
Acid and base chemical processing. Hot plate, DI water and N2 dry. Wafer and piece processing available.
Technics 800 RIE
The Technics 800 Micro Reactive Ion Etch system utilizes various components in a specific sequence to etch thin films of silicon oxide and silicon nitride. The RIE is capable of processing samples from small pieces up to 6 inch wafers.
DEPOSITION AND SPUTTERING
High quality deposition and thin film coatings are provided by a select equipment set with proven success across a wide range of technologies. The cleanroom facility offers both E – Beam and Sputtering applications along with Plasma Enhanced dielectric depositions.
Denton DV 602 Sputtering System
Sputtering allows single or multiple thin film compositions such as Al, AlSi(1%), AlSi(1%)Cu(0.5%), to be deposited onto samples from a single custom fabricated source target. The Denton DV-602 sputtering system holdstwo 4” magnetron source material targets that can be fed by either a DC or RF power supply. The RF power supply is used to sputter dielectric materials. The partial pressures of up to three different sputtering gases are controlled by mass flow controllers. Up to six 3” diameter substrates can be loaded onto a rotary platen for sputtered thin film depositions.
Eddy SC 20 E-beam Evaporator
The Eddy E beam metal system is a 4 pocket metal evaporator capable of running up to 4 different metals in a single run, without breaking vacuum. The SC 20 controller allows for real-time film thickness monitoring. Deposition rates starting at 0.1A per second can be achieved. Available metals include Ag, Au, Cr, Cu, Ge, Ni, Pt and Ti.
Indel E-beam Evaporator
The Indel E beam evaporator is a cryo pumped high vacuum system using a Telemark TT-6 power supply and a four pocket crucible assembly. Evaporation of four different materials is possible without breaking vacuum. A specially designed viewing fixture allows continuous monitoring of single or multi layer processes. The processes are controlled by a Sycon STC – 200 controller. The chamber contains three planetary holders, each designed to hold up to 6 three inch wafers. Smaller samples can be affixed to an adapter plate. The planetary can be rotated during the run to provide uniform film thickness and step coverage. Rods or other types of holders can be used to hold samples for lift off. This system has been used for aluminum, titanium, gold, platinum, silver, chromium, nickel, ITO, molybdenum, copper and tantalum. Other metals evaporation and deposition are possible.
Mission Peak MP 100S
The Mission Peak MP 100S is a noncontact thin film measurement system with a spectrometer and optical probe mounted on an X-Y stage. The MP100-S measures Oxide, Nitride, Photoresist, Ploysilicon, CIE chromaticity, cell gap, color filter and polyimide/ITO thickness. The MP100 offers a 3D measurement display and 4 layers of measurement capability.
Plasmatherm 790 PECVD
The Plasmatherm 790 is a flexible parallel plate Plasma Enhanced Chemical Vapor Deposition system. Silicon oxide and silicon nitride deposition are possible using temperatures ranging from 80 degrees C to 400 degrees C. Sample sizes up to 6 inches can be processed.
Tencor Alpha-Step D-500 Stylus Profiler
The Tencor Alpha Step 500 is a high magnification programmable measurement system for both thin and thick films. The Alpha-Step D-500 stylus profiler is capable of measuring 2D step heights from a few nanometers up to 1200µm. The D-500 also supports 2D measurements of roughness, bow and stress for R&D and production environments.
Packaging
The CPN faculty and staff support a variety of technologies and equipment to meet the needs of our researchers. Precise sample preparation of a wide range of materials is possible utilizing our capabilities in Polishing, Sectioning and Wire Bonding.
Allied Techprep Polishing
The Techprep System enables precise semi-automatic sample preparation of a wide range of materials for microscopic (optical, SEM, EBSD, FIB, TEM, AFM, etc.) evaluation. Capabilities include parallel polishing, angle polishing, site-specific polishing or any combination thereof. It provides reproducible sample results by eliminating inconsistencies between users, regardless of their skill.
Isomet 4000
The IsoMet 4000 Precision Saw was designed for cutting various material types with minimal deformation. 1 micron sample positioning allows for precise sectioning of specimens. User selectable feed rate allows for ultimate versatility.
Kulicke & Soffa Wire Bonder
The K & S is an advanced wedge bonder used for process development, production and research. It provides high yield and excellent repeatability.
Nikon MM – 60
The Nikon MM – 60 enables much more accurate measurements of the Z-axis. The measuring microscope has a linear glass scale that covers the full range of vertical movements.